With the acquisition of IXYS, Littelfuse significantly expands the breadth of its power semiconductor portfolio, with solutions spanning a full range of technologies. This diverse portfolio will provide customers with the best technology and enhanced, differentiated capabilities in target markets and geographies as well as deliver greater industry access and increased growth opportunities. Below are the 3 business units that will gradually merge into IXYS a Littelfuse Technology as Littelfuse Inc. integrates them into their portfolio of by a world class products.
IXYS a Littelfuse Technology has gained a worldwide reputation as a premier power semiconductor manufacturer. Its diversified product base of specialized power semiconductors, integrated circuits and RF power include low on-resistance Power MOSFETs, Ultra Fast switching IGBTs, Fast Recovery Diodes (FREDs), SCR and Diode Modules, Rectifier Bridges, and Power Interface ICs for applications ranging across industrial, transportation, telecommunications, computer, medical, consumer and clean tech markets.
IXYS Integrated Circuits Division, formerly Clare, Inc., now part of Littelfuse, designs, manufactures, and markets high-voltage integrated circuits (ICs) and optically isolated Solid State Relays (OptoMOS®) for the communication, industrial, power, and consumer markets. As a pioneer in the development of Solid State Relays (SSRs), they have become a leading supplier to the telecommunications, security, utility metering, and industrial control industries. IXYS Integrated Circuits Division SSR solutions are rapidly replacing older electromechanical devices in many applications and enhancing overall system performance. They continue to develop leadership products that offer higher levels of integration and electrical performance.
IXYS RF/Littelfuse brand continues to provide high-performance MOSFETs, drivers, and integrated modules using the DE-Series package. The design team at IXYS/Littelfuse has developed die specifically for use in their DE-Series package and have leveraged the available industry standard packaging to make their technology available to a wider array of applications and markets.