In electronic manufacturing, identifying component packaging accurately is just as important as selecting the correct electrical specification. Packaging affects how a component is mounted, how it performs under mechanical and thermal stress, and how smoothly it moves through the assembly line. Among the many package families, two remain the most commonly encountered: Surface-Mount Device (SMD) and Dual-In-Line Package (DIP). For procurement teams, engineers, and quality inspectors, being able to distinguish these packages quickly helps prevent sourcing errors, reduces rework, and ensures the right fit for the intended PCB design.