Summary:
CFB-801 is a NB-IoT standard communication module with a frequency range of 617-960MHz, 1710-2200MHz, and initially supports Band 1, 5, 8, 20, and 28 frequency bands.
It is mainly used in low-power data transmission services and complies with the NB-IoT radio communication protocol (3GPP Release-14) standard. CFB-801 complies with the module requirements white paper-NB-IoT module hardware specification volume (2017.V1) standard requirements.
The CFB-801 module can be connected with many terminal devices, embedded with data transmission protocols such as TCP/UDP/CoAP/MQTT/HTTP(S)/LWM2M, and supports 3GPP Rel14 and extended AT commands. Support base station positioning. It can meet almost all application requirements of the Internet of Things. For example: smart metering, shared bicycles, smart parking, smart cities, security, asset tracking, smart home appliances, agriculture and environmental monitoring, etc.
The CFB-801 is packaged in an LCC chip and has an ultra-small size of 20mm × 16mm × 2.2mm.
The CFB-801 module adopts power-saving technology, and the current consumption is less than 0.8uA in power-saving mode (PSM).
Storage:
CFB-801 ships in a vacuum-sealed bag.
The storage of modules must comply with the following conditions:
When the ambient temperature is below 40 degrees Celsius and the air humidity is below 90% (RH), the module can be stored in a vacuum-sealed bag for 12 months.
After the vacuum-sealed bag is opened, the module can be directly subjected to reflow soldering or other high-temperature processes if the following conditions are met:
Module storage air humidity is less than 10%.
The ambient temperature of the module is lower than 30 degrees Celsius, and the air humidity is lower than 60%. The factory completes the placement within 72 hours.
If the module is under the following conditions, it needs to be baked before placement:
When the ambient temperature is 23 degrees Celsius (up and down 5 degrees Celsius fluctuation is allowed), the humidity indicator card shows that the humidity is greater than 10%.
When the vacuum-sealed bag is opened, the ambient temperature of the module is lower than 30 degrees Celsius, and the air humidity is lower than 60%, but the factory fails to operate at 72
Finish the patch within an hour.
When the vacuum-sealed bag is opened, the module storage air humidity is greater than 10%.
If the module needs to be baked, please bake it at 125 degrees Celsius (up and down 5 degrees Celsius is allowed) for 8 hours, and the cumulative baking time is less than 6 hours.
Production welding:
Use a printing squeegee to print solder paste on the screen, so that the solder paste can be printed on the PCB through the opening of the screen, and the force of the printing squeegee needs to be adjusted appropriately.
In order to ensure the quality of the module printing paste, the thickness of the stencil corresponding to the pad part of the CFB-801 module is recommended to be about 0.18mm.
The recommended reflow temperature is 235~245°C, and the maximum temperature should not exceed 260°C. In order to avoid damage to the module due to repeated heating, it is recommended that the customer attach the module after completing the reflow soldering of the first side of the PCB.
