Program introduction:
The intelligent control system has powerful functions. It only needs to set the chip size to automatically generate the chip grinding tool path, which is convenient and fast to grind the chip. The platform has a built-in precision sensor, which automatically monitors the flatness of the chip, analyzes and generates surface grinding data, and solves the problem of unsatisfactory grinding effect caused by the deformation of the motherboard. The high-definition camera is more convenient and clear to distinguish and polish the IC level, which is beneficial to understand the problem of processing depth. Grinding accuracy 0.01mm Spindle power 24000rpm Effective stroke 200*100*100mm Table travel 205*245mm Dimensions 580*560*750mm Working voltage 220V The weight of the whole machine is 80KG.
Performance parameters:
Industry Classification : Industrial Electronics Development platform: NXP NXP, TI Texas Instruments Delivery form: PCBA, whole machine, IOT system Performance parameters: normal temperature: -20~50℃ Application scenarios: chip manufacturing, PCBA patch processing, SMT, industrial circuit board line.
