With the goal of becoming the world's leading substrate supplier, Unimicron is committed to quality-backed production and customer-oriented service ," said TJ Tseng, Chairman of Unimicron. "We are very excited to join TSMC's new 3D Fabric Alliance as part of the alliance's As a member, Unimicron has the opportunity to contribute to innovation in packaging technology and to develop and optimize advanced solutions in parallel with other semiconductor and technology leaders. Together with TSMC, we will provide high-quality solutions to mutual customers in a timely manner. "
It is reported that members of the 3DFabric Alliance can obtain TSMC's 3DFabric technology as early as possible, enabling them to develop and optimize solutions simultaneously with TSMC, and also allow customers to take a leading position in product development, early access from EDA and IP to DCA / VCA, storage, commissioning The highest quality and established solutions and services for Outer Package Test (OSAT), Substrate and Test.
"In previous generations and current HBM, SK hynix has been working closely with TSMC to achieve CoWoS process compatibility and HBM interaction," said Dr. Kangwook Lee, senior vice president and head of PKG development at SK hynix, "by adding new With the 3D Fabric Alliance, SK hynix is working more deeply with TSMC to provide solutions for future HBM and enable system product innovation."
In order to promote the development of 3D semiconductors, the Open Innovation Platform (OIP) 3D Fabric Alliance was established. Currently, Samsung, Micron, SK Hynix, ASE, ARM, Synopsys, Advantest, WorldCore, Alphawave, Amkor, Ansys, Cadence, Creative Electronics, IBIDEN, Siemens, Silicon Creations, Silicon Precision Industries, Teradyne, Unimicron 19 partners agreed to join.
Over the years, Cadence has grown rapidly in EDA and IP collaboration, enabling customers to successfully leverage 3D Fabric technology," said Dr. Chin-Chi Teng, senior vice president and general manager of the Digital Signoff Group at Cadence. Breakthroughs include EDA's innovation in the 3D blox standard, and certification of the complete 3D IC platform, our unified 3D IC planning, implementation and analysis solution. On the IP side, we delivered 40Gbps/lane Hyperlink D2D PHY IP and 112G-XSR PHY IP, providing a strong roadmap for the Universal Chiplet Interconnect Express (UCIe) standard for connecting chiplets. By joining the new OIP 3D Fabric consortium, we are strengthening our commitment to jointly advance emerging multi-chip-based technologies for hyperscale computing, mobile, 5G and AI applications. "
