T product-Perceptive Electronic Components

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Picture

Model

Description

Quantity

Unite Price

TC648BEUA713
Brand: Microchip Technology

Package Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
RoHs Status: ROHS3 Compliant

Stock: 1559

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TPIC2030DBTRG4
Brand: Texas Instruments

Package Case: 44-TFSOP (0.173&quot;, 4.40mm Width)
RoHs Status: ROHS3 Compliant

Stock: 9831

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TLE95613QXXUMA1
Brand: Infineon Technologies

Package Case: 48-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 7361

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TB62D901FNG,EL
Brand: Toshiba Semiconductor and Storage

Package Case: -
RoHs Status: RoHS Compliant

Stock: 8296

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TB67H450AFNG,EL
Brand: Toshiba Semiconductor and Storage

Package Case: 8-SOIC (0.154&quot;, 3.90mm Width) Exposed Pad
RoHs Status:

Stock: 8994

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TLE9562QXXUMA1
Brand: Infineon Technologies

Package Case: 48-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 1178

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TLE9561QXXUMA1
Brand: Infineon Technologies

Package Case: 48-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 7915

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TLE8444SLXUMA1
Brand: Infineon Technologies

Package Case: 24-SSOP (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant

Stock: 3138

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TLE9564QXXUMA1
Brand: Infineon Technologies

Package Case: 48-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 6158

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TEA1716T/2,518
Brand: NXP USA Inc.

Package Case: 24-SOIC (0.295", 7.50mm Width)
RoHs Status: ROHS3 Compliant

Stock: 2176

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TLE5206-2IN-ND
Brand: Infineon Technologies

Package Case: -
RoHs Status: Not applicable

Stock: 4528

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TLS2271BDGGR
Brand: Texas Instruments

Package Case: -
RoHs Status: Not applicable

Stock: 1126

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TLE9185QXV33XUMA1
Brand: Infineon Technologies

Package Case: 48-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 2927

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TLE9185QXXUMA1
Brand: Infineon Technologies

Package Case: 48-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 6180

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TB67S539FTG(O,EL)
Brand: Toshiba Semiconductor and Storage

Package Case: 32-VFQFN Exposed Pad
RoHs Status:

Stock: 2288

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TLE95603QXXUMA1
Brand: Infineon Technologies

Package Case: 48-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 9850

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TB67H302HG
Brand: Toshiba Semiconductor and Storage

Package Case: 25-SIP Formed Leads
RoHs Status: RoHS Compliant

Stock: 3932

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T89C5121-ICUIL
Brand: Microchip Technology

Package Case: 24-SSOP (0.209", 5.30mm Width)
RoHs Status: RoHS non-compliant

Stock: 6629

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TB67S158NG
Brand: Toshiba Semiconductor and Storage

Package Case: 24-SDIP (0.300", 7.62mm)
RoHs Status: RoHS Compliant

Stock: 1059

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TB67S142HG
Brand: Toshiba Semiconductor and Storage

Package Case: 25-SIP Formed Leads
RoHs Status: RoHS Compliant

Stock: 4560

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TDA48632XKLA1
Brand: Infineon Technologies

Package Case: 8-DIP (0.300", 7.62mm)
RoHs Status:

Stock: 9015

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TB67S101ANG
Brand: Toshiba Semiconductor and Storage

Package Case: 24-SDIP (0.300&quot;, 7.62mm)
RoHs Status: RoHS Compliant

Stock: 6395

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TB67S101AFTG,EL
Brand: Toshiba Semiconductor and Storage

Package Case: 48-WFQFN Exposed Pad
RoHs Status: RoHS Compliant

Stock: 9157

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TDA4862
Brand: Infineon Technologies

Package Case: 8-DIP (0.300", 7.62mm)
RoHs Status:

Stock: 3248

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TB67S285FTG,EL
Brand: Toshiba Semiconductor and Storage

Package Case: 48-VFQFN Exposed Pad
RoHs Status: RoHS Compliant

Stock: 3362

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