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Model
Description
Quantity
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MAX19506ETM+
MAX19506ETM+
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 48-WFQFN Exposed Pad
RoHs Status: ROHS3 Compliant
Stock: 9960
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MPXM2053GST1
MPXM2053GST1
Brand: NXP USA Inc.
Package Case: 5-SMD Module, Top Port
RoHs Status: ROHS3 Compliant
Stock: 6786
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MPX12GP
MPX12GP
Brand: NXP USA Inc.
Package Case: 4-SIP Module
RoHs Status: ROHS3 Compliant
Stock: 6339
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MPXM2010D
MPXM2010D
Brand: NXP USA Inc.
Package Case: 5-SMD Module
RoHs Status: ROHS3 Compliant
Stock: 1006
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MPVZ5004G6U
MPVZ5004G6U
Brand: NXP USA Inc.
Package Case: 8-SMD Module
RoHs Status: ROHS3 Compliant
Stock: 9095
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MPXA4115A6U
MPXA4115A6U
Brand: NXP USA Inc.
Package Case: 8-SMD Module
RoHs Status: ROHS3 Compliant
Stock: 7170
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MAX1153BEUE+
MAX1153BEUE+
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 16-TSSOP (0.173", 4.40mm Width)
RoHs Status: ROHS3 Compliant
Stock: 2840
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MPXV5010G6U
MPXV5010G6U
Brand: NXP USA Inc.
Package Case: 8-SMD Module
RoHs Status: ROHS3 Compliant
Stock: 2822
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MCP3564-E/ST
MCP3564-E/ST
Brand: Microchip Technology
Package Case: 20-TSSOP (0.173", 4.40mm Width)
RoHs Status: ROHS3 Compliant
Stock: 7118
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MAX1287ETA+T
MAX1287ETA+T
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 8-WDFN Exposed Pad
RoHs Status: ROHS3 Compliant
Stock: 6282
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MPVZ5010G6U
MPVZ5010G6U
Brand: NXP USA Inc.
Package Case: 8-SMD Module
RoHs Status: ROHS3 Compliant
Stock: 1707
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MAX1243BCSA+
MAX1243BCSA+
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 8-SOIC (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant
Stock: 9660
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MPX2100D
MPX2100D
Brand: NXP USA Inc.
Package Case: 4-SIP Module
RoHs Status: ROHS3 Compliant
Stock: 6363
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MAX11328ATJ+
MAX11328ATJ+
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 32-WFQFN Exposed Pad
RoHs Status: ROHS3 Compliant
Stock: 8510
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MAX1249BCEE+
MAX1249BCEE+
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 16-SSOP (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant
Stock: 1861
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MAX1240CCSA+
MAX1240CCSA+
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 8-SOIC (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant
Stock: 1466
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MPVZ5010GP
MPVZ5010GP
Brand: NXP USA Inc.
Package Case: -
RoHs Status: RoHS non-compliant
Stock: 8728
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MAX1113EEE+
MAX1113EEE+
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 16-SSOP (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant
Stock: 9156
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MAX1241CESA+
MAX1241CESA+
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 8-SOIC (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant
Stock: 6820
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MAX148BCAP+
MAX148BCAP+
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 20-SSOP (0.209", 5.30mm Width)
RoHs Status: ROHS3 Compliant
Stock: 2179
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MAX147CEAP+
MAX147CEAP+
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 20-SSOP (0.209", 5.30mm Width)
RoHs Status: ROHS3 Compliant
Stock: 6528
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MPX2200D
MPX2200D
Brand: NXP USA Inc.
Package Case: 4-SIP Module
RoHs Status: ROHS3 Compliant
Stock: 6392
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MPX10D
MPX10D
Brand: NXP USA Inc.
Package Case: 4-SIP Module
RoHs Status: ROHS3 Compliant
Stock: 6261
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MAX1030BCEG+
MAX1030BCEG+
Brand: Analog Devices Inc./Maxim Integrated
Package Case: 24-SSOP (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant
Stock: 1488
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MLX90821LXG-DBA-100-SP
MLX90821LXG-DBA-100-SP
Brand: Melexis Technologies NV
Package Case: 16-SOIC (0.295", 7.50mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant
Stock: 7487
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