M product-Perceptive Electronic Components

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Picture

Model

Description

Quantity

Unite Price

MSP430F1122IPW
Brand: Texas Instruments

Package Case: 20-TSSOP (0.173", 4.40mm Width)
RoHs Status: ROHS3 Compliant

Stock: 8271

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MAX873AESA
Brand: Analog Devices Inc./Maxim Integrated

Package Case: -
RoHs Status:

Stock: 5819

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MIC2287-24YML-TR
Brand: Microchip Technology

Package Case: 8-VFDFN Exposed Pad, 8-MLF®
RoHs Status: ROHS3 Compliant

Stock: 4913

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MSP430G2533IN20
Brand: Texas Instruments

Package Case: 20-DIP (0.300", 7.62mm)
RoHs Status: ROHS3 Compliant

Stock: 4835

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MAX6330SUR+
Brand: Analog Devices Inc./Maxim Integrated

Package Case: -
RoHs Status:

Stock: 2846

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MFRC63102HN,157
Brand: NXP USA Inc.

Package Case: 32-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 3409

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MFRC63102HN,118
Brand: NXP USA Inc.

Package Case: 32-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 2133

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MMA1200KEG
Brand: NXP USA Inc.

Package Case: 16-SOIC (0.295", 7.50mm Width)
RoHs Status: ROHS3 Compliant

Stock: 4776

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MAX6951EEE
Brand: Analog Devices Inc./Maxim Integrated

Package Case: -
RoHs Status: RoHS non-compliant

Stock: 5039

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MMA6255AKEG
Brand: NXP USA Inc.

Package Case: 20-SOIC (0.295", 7.50mm Width)
RoHs Status: ROHS3 Compliant

Stock: 8404

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MF3ICDH8101DUD/05,
Brand: NXP USA Inc.

Package Case: Die
RoHs Status: ROHS3 Compliant

Stock: 4761

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MFRC63002HN,157
Brand: NXP USA Inc.

Package Case: 32-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 4611

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MSP430G2353IPW20
Brand: Texas Instruments

Package Case: 20-TSSOP (0.173", 4.40mm Width)
RoHs Status: ROHS3 Compliant

Stock: 8455

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MF3MODH4101DA8/05,
Brand: NXP USA Inc.

Package Case: Die
RoHs Status: ROHS3 Compliant

Stock: 5017

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MMA3221KEG
Brand: NXP USA Inc.

Package Case: 20-SOIC (0.295", 7.50mm Width)
RoHs Status: ROHS3 Compliant

Stock: 6110

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MSP430F2012IN
Brand: Texas Instruments

Package Case: 14-DIP (0.300", 7.62mm)
RoHs Status: ROHS3 Compliant

Stock: 3805

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MF3MOD4101DA4/05,1
Brand: NXP USA Inc.

Package Case: MOA4, Smart Card Module
RoHs Status: ROHS3 Compliant

Stock: 8566

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MMA2244KEG
Brand: NXP USA Inc.

Package Case: 16-SOIC (0.295", 7.50mm Width)
RoHs Status: ROHS3 Compliant

Stock: 4566

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MFRC52202HN1,157
Brand: NXP USA Inc.

Package Case: 32-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 2468

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MFRC52201HN1,115
Brand: NXP USA Inc.

Package Case: 32-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 7206

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MF3MOD4101DA8/05,1
Brand: NXP USA Inc.

Package Case: MOA8, Smart Card Module
RoHs Status: ROHS3 Compliant

Stock: 9963

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MSP430G2452IN20
Brand: Texas Instruments

Package Case: 20-DIP (0.300", 7.62mm)
RoHs Status: ROHS3 Compliant

Stock: 9892

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MF3MODH8101DA8/05,
Brand: NXP USA Inc.

Package Case: Die
RoHs Status: ROHS3 Compliant

Stock: 9522

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MSP430F2002IPW
Brand: Texas Instruments

Package Case: 14-TSSOP (0.173", 4.40mm Width)
RoHs Status: ROHS3 Compliant

Stock: 7349

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MMA6527KCWR2
Brand: NXP USA Inc.

Package Case: 16-QFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 4235

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