PMIC-Perceptive Electronic Components

PMIC

Picture

Model

Description

Quantity

Unite Price

FSB50550US
Brand: onsemi

Package Case: 23-PowerSMD Module, Gull Wing
RoHs Status: ROHS3 Compliant

Stock: 9625

1+
10+
25+
50+
100+

ADP199ACBZ-R79
Brand: Analog Devices Inc.

Package Case: -
RoHs Status:

Stock: 6900

1+
10+
25+
50+
100+

FSB50325A
Brand: onsemi

Package Case: 23-PowerDIP Module (0.573", 14.56mm)
RoHs Status: ROHS3 Compliant

Stock: 4362

1+
10+
25+
50+
100+

FSB50825TB2
Brand: onsemi

Package Case: 23-PowerDIP Module (0.748", 19.00mm)
RoHs Status: Not applicable

Stock: 4827

1+
10+
25+
50+
100+

MC33981ADHFK
Brand: NXP USA Inc.

Package Case: 16-PowerQFN
RoHs Status: ROHS3 Compliant

Stock: 6251

1+
10+
25+
50+
100+

MC08XS6421DEKR2
Brand: NXP USA Inc.

Package Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 3308

1+
10+
25+
50+
100+

IKCM15L60GAXKMA1
Brand: Infineon Technologies

Package Case: 24-PowerDIP Module (1.028", 26.10mm)
RoHs Status: ROHS3 Compliant

Stock: 6158

1+
10+
25+
50+
100+

FSB70625
Brand: onsemi

Package Case: 27-PowerLQFN Module
RoHs Status: ROHS3 Compliant

Stock: 4794

1+
10+
25+
50+
100+

MC07XS6517DEK
Brand: NXP USA Inc.

Package Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 7023

1+
10+
25+
50+
100+

STIB1560DM2T-L
Brand: STMicroelectronics

Package Case: 26-PowerDIP Module (1.146", 29.10mm)
RoHs Status:

Stock: 1758

1+
10+
25+
50+
100+

IKCM20L60GBXKMA1
Brand: Infineon Technologies

Package Case: -
RoHs Status: Not applicable

Stock: 9874

1+
10+
25+
50+
100+

MC17XS6500EEKR2
Brand: NXP USA Inc.

Package Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 5902

1+
10+
25+
50+
100+

IM818LCCXKMA1
Brand: Infineon Technologies

Package Case: 24-PowerDIP Module (1.094", 27.80mm)
RoHs Status: ROHS3 Compliant

Stock: 5645

1+
10+
25+
50+
100+

FSB50450US
Brand: onsemi

Package Case: 23-PowerSMD Module, Gull Wing
RoHs Status: ROHS3 Compliant

Stock: 1253

1+
10+
25+
50+
100+

MC07XS6517DEKR2
Brand: NXP USA Inc.

Package Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 1033

1+
10+
25+
50+
100+

FF450R08A03P2XKSA1
Brand: Infineon Technologies

Package Case: Module
RoHs Status: ROHS3 Compliant

Stock: 1563

1+
10+
25+
50+
100+

FSB52006S
Brand: onsemi

Package Case: 23-PowerSMD Module, Gull Wing
RoHs Status: ROHS3 Compliant

Stock: 4901

1+
10+
25+
50+
100+

IKCM15F60GAXKMA1
Brand: Infineon Technologies

Package Case: 24-PowerDIP Module (1.028", 26.10mm)
RoHs Status: ROHS3 Compliant

Stock: 6727

1+
10+
25+
50+
100+

IRAM336-025SB
Brand: Infineon Technologies

Package Case: 19-SSIP Formed Leads
RoHs Status: RoHS non-compliant

Stock: 2706

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10+
25+
50+
100+

MC08XS6421DEK
Brand: NXP USA Inc.

Package Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 2405

1+
10+
25+
50+
100+

FPF3188AUCX
Brand: onsemi

Package Case: -
RoHs Status: ROHS3 Compliant

Stock: 8613

1+
10+
25+
50+
100+

NCV8408DTDRKG
Brand: onsemi

Package Case: TO-252-3, DPak (2 Leads + Tab), SC-63
RoHs Status: ROHS3 Compliant

Stock: 7483

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10+
25+
50+
100+

NCV8408DTCRKG
Brand: onsemi

Package Case: TO-252-3, DPak (2 Leads + Tab), SC-63
RoHs Status: ROHS3 Compliant

Stock: 5439

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10+
25+
50+
100+

NCV8402MNWCT1G
Brand: onsemi

Package Case: 6-VDFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 8420

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10+
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50+
100+

MAX14900EAGM+TCKH
Brand: Analog Devices Inc./Maxim Integrated

Package Case: 48-WFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 1283

1+
10+
25+
50+
100+