PMIC-Perceptive Electronic Components

PMIC

Picture

Model

Description

Quantity

Unite Price

TB6552FNG,C,8,EL
Brand: Toshiba Semiconductor and Storage

Package Case: 16-LSSOP (0.173", 4.40mm Width)
RoHs Status: RoHS Compliant

Stock: 9322

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TC642BEUA
Brand: Microchip Technology

Package Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
RoHs Status: ROHS3 Compliant

Stock: 5519

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100+

TC646EOA
Brand: Microchip Technology

Package Case: 8-SOIC (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant

Stock: 3253

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DRV2604LYZFT
Brand: Texas Instruments

Package Case: 9-UFBGA, DSBGA
RoHs Status: ROHS3 Compliant

Stock: 8436

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TB62216FNG,C8,EL
Brand: Toshiba Semiconductor and Storage

Package Case: 48-TFSOP (0.240", 6.10mm Width) Exposed Pad
RoHs Status: RoHS Compliant

Stock: 6434

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100+

TC647BEUA
Brand: Microchip Technology

Package Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
RoHs Status: ROHS3 Compliant

Stock: 7364

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MTD6501D-HC1
Brand: Microchip Technology

Package Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
RoHs Status: ROHS3 Compliant

Stock: 7207

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50+
100+

FPAL30SL60
Brand: onsemi

Package Case: 30-PowerDIP Module
RoHs Status: Not applicable

Stock: 5695

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50+
100+

DRV2605YZFT
Brand: Texas Instruments

Package Case: 9-UFBGA, DSBGA
RoHs Status: ROHS3 Compliant

Stock: 6870

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50+
100+

TC649BEUA
Brand: Microchip Technology

Package Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
RoHs Status: ROHS3 Compliant

Stock: 1462

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10+
25+
50+
100+

MTD6501C-HC1
Brand: Microchip Technology

Package Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 4261

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50+
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TC647BEOATR
Brand: Microchip Technology

Package Case: 8-SOIC (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant

Stock: 2602

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10+
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50+
100+

DRV10963JMDSNT
Brand: Texas Instruments

Package Case: 10-UFDFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 8102

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50+
100+

TC648BEUA
Brand: Microchip Technology

Package Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
RoHs Status: ROHS3 Compliant

Stock: 2016

1+
10+
25+
50+
100+

DRV10963JADSNT
Brand: Texas Instruments

Package Case: 10-UFDFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 4791

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10+
25+
50+
100+

TC649BEOA
Brand: Microchip Technology

Package Case: 8-SOIC (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant

Stock: 6751

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10+
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50+
100+

TC647BEOA
Brand: Microchip Technology

Package Case: 8-SOIC (0.154", 3.90mm Width)
RoHs Status: ROHS3 Compliant

Stock: 7085

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10+
25+
50+
100+

DRV10964FFDSNT
Brand: Texas Instruments

Package Case: 10-UFDFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 6988

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25+
50+
100+

IMC099TT038XUMA1
Brand: Infineon Technologies

Package Case: 38-TFSOP (0.173", 4.40mm Width)
RoHs Status: ROHS3 Compliant

Stock: 1600

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50+
100+

DRV8837CDSGT
Brand: Texas Instruments

Package Case: 8-WFDFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 1207

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50+
100+

TLE95633QXXUMA1
Brand: Infineon Technologies

Package Case: 48-VFQFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 7324

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100+

DRV8601DRBT
Brand: Texas Instruments

Package Case: 8-VDFN Exposed Pad
RoHs Status: ROHS3 Compliant

Stock: 4506

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100+

IMD112T6F040XUMA1
Brand: Infineon Technologies

Package Case: 40-LQFP
RoHs Status: ROHS3 Compliant

Stock: 5835

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50+
100+

LC898200A-TBM-H
Brand: onsemi

Package Case: -
RoHs Status:

Stock: 5356

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100+

LV8316HGR2G
Brand: onsemi

Package Case: -
RoHs Status:

Stock: 4735

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100+